| Specifications | 175φ×30T |
|---|---|
| Velcro | 155φ |
- FE News»
- PPS News»
- Oct. 31, 2024
- [News Release R-1020] Release of "ECHELON Zen-Xero DYNAMIX”
- May. 15, 2024
- [News Release R-1019] Release of "ECHELON Ver.3.0”
- Oct. 02, 2023
- [News Release R-1018]Compound that achieves a genuine finish Full Renewal of “KATANA” Series
- Jun. 27, 2023
- [News Release] A final finishing compound that achieves a beautiful wet gloss. "KATANA DARK-SHOT" is Released.
- May. 22, 2023
- [News Release] Full renewal of buffing pad category Brand integrated into HAYABUSA
CCS FLAT Black 175φ (Micro Cell) 
Background of CCS Technology
Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology™ solves this common problem using strategic patterns of partially closed foam cells.
Uniformed dimple patterns
that maximizes performance of polishing compounds
The center protrusion controls stagnation and uniform spread of polishing compounds and achieves higher quality finish.
Benefits of CCS Technology
- Slow Rate of Polish Absorption
- CCS pockets gradually release polish as needed by the operator.
- Prevents Pad Skipping
- CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
- Creates Less Heat
- CCS pockets reduce surface contact resulting in less friction generated heat.
